Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

Semiconductor equipment makers ASMPT and Kokusai Electric have entered a joint development agreement aimed at advancing ...

Want to learn 3D IC technology in one go? Here is all you need to know about this heterogeneous integration technique.

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Blaise Santi is a recent graduate of NYU's Tisch School of the Arts majoring in Dramatic Writing. He's had experience writing not only for screen and stage, but also for sketch and late-night. His ...