By Wen-Yee Lee TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, ...

Q1 2026 Management View Lester Wong, Interim CEO, Executive VP of Finance & IT and CFO, stated demand is improving faster and stronger than previously expected, with customer sentiment strengthening ...

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting ...

Investments in automation and additional tools for data analytics keep coming to packaging lines as plants become more connected. Machine learning and digital twin technology are increasing throughput ...

WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- As the global pharmaceutical and healthcare ...

ASE Technology Holding stated that robust demand for advanced semiconductor packaging services drove growth throughout 2025, ...

At the forefront of this high-stakes industry stands Capcon Limited — a dynamic Singapore-based company that has rapidly ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...

Diamond Quanta today announced Adamantine Thermal(TM), an engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous semiconductor systems. The ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia ...