AI and robots help Hawke's Bay apple exporter double processing capacity

Every day, about 10 40 foot shipping containers of apples are trucked out of Taylor Corp Apple's packhouse to be exported ...
TweakTown

Apple is TSMC's first 2nm client of 2025: new iPhone 17, SoIC advanced packaging for M5 chips

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...
TweakTown

Apple expected to use TSMC's 2nm process, SoIC-X packaging tech in 2H 2025

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...
SiliconANGLE

Apple to become largest customer of new $2B chip packaging facility in Arizona

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...