The partnership between X-FAB and Thalia aims to preserve the integrity of design transitions from one process node to ...
Design teams are under pressure to integrate more functionality in less time. Structured metadata and automation help manage ...
Creating reusable and portable analog intellectual property (IP) is a key trend to watch in EDA for 2009 and beyond. Finding a way to develop reusable analog IP will allow designers to build ...
As the first 64 Gbps UCIe™ IP subsystem implemented on TSMC's 3nm process, this achievement positions Alphawave Semi as a leader in UCIe die-to-die connectivity technology. With enhanced 64 Gbps UCIe ...
To overcome 45-nm process challenges, semiconductor intellectual property (IP) providers and foundries are collaborating to provide designers with a combination of design resources and manufacturing ...
An underlying requirement for successful IP interchange between providers and integrators is a strong reliance on standards. Although the industry has achieved some success with a metric such as the ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced ...
Deciding what to patent can be a confusing process but by creating a formal process it is something that every startup can manage. Intellectual property (IP) is one of the most valuable assets of a ...
ODVA has added process device profiles to the EtherNet/IP specification to provide a standard format for process variables and diagnostics and support Ethernet-APL. An example of EtherNet/IP CAT5e ...
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