Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.

A new technical paper, “Exploring Silent Data Corruption as a Reliability Challenge in LLM Training,” was published by ...

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...