India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

BHUBANESWAR: Taking a major leap in its semiconductor ecosystem ambitions, the state government on Sunday laid the foundation ...

Dr. Rachmady brings more than 20 years of technical and strategic leadership in advanced semiconductor technologies to Aeluma. Most recently, he served as a senior technical leader at Intel ...

The foundation stone for the first advanced 3D semiconductor packaging unit in India has been laid at Info Valley in ...

Union Minister Ashwini Vaishnaw declares the foundation of the 3DGS semiconductor plant in Odisha as a historic day, marking ...

Aeluma, Inc. (NASDAQ: ALMU), a semiconductor company specializing in high-performance, scalable technologies for mobile, AI, defense and aerospace, ...

Odisha poised to power PM Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing: Chief ...

The foundation stone of the Heterogeneous Integration Packaging Solutions project, promoted by 3D Glass Solutions, was laid in the presence of Chief Minister Shri Mohan Charan Majhi and Union Minister ...

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip ...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status ...

But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in ...

India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...