Engineering considerations in multi-chiplet designs.

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Leveraging patterns in formal verification to reach sign-off faster.

When Finland’s Donut Lab claimed earlier this year that it had developed a solid-state battery capable of storing 400 ...

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Marvell's plasmonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; ...

AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can ...