India Today on MSN

India gets first advanced 3D chip packaging plant, Intel helping it set up in Odisha

India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

Odisha joins semicon league with launch of India’s first 3D chip unit

BHUBANESWAR: Taking a major leap in its semiconductor ecosystem ambitions, the state government on Sunday laid the foundation ...

Aeluma Appoints Willy Rachmady Vice President of Strategic Partnerships and Ecosystem

Dr. Rachmady brings more than 20 years of technical and strategic leadership in advanced semiconductor technologies to Aeluma. Most recently, he served as a senior technical leader at Intel ...
Analytics India Magazine

Foundation for India’s First 3D Chip Packaging Unit Laid in Odisha

The foundation stone for the first advanced 3D semiconductor packaging unit in India has been laid at Info Valley in ...

India’s First 3D Semiconductor Plant In Odisha Is Already Booked. Why It Matters | Explained

Even before the first structure has come up, demand is already locked in.That’s what makes Odisha’s new semiconductor project ...
DATAQUEST

Groundbreaking of India’s first advanced 3D semiconductor packaging unit in Odisha

Odisha poised to power PM Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing: Chief ...

Aeluma, Inc.: Aeluma Appoints Willy Rachmady Vice President of Strategic Partnerships and Ecosystem

Aeluma, Inc. (NASDAQ: ALMU), a semiconductor company specializing in high-performance, scalable technologies for mobile, AI, defense and aerospace, ...

Ashwini Vaishnaw calls 3DGS semiconductor plant foundation in Odisha a 'historic day

Union Minister Ashwini Vaishnaw declares the foundation of the 3DGS semiconductor plant in Odisha as a historic day, marking ...
News9 Live on MSN

Odisha emerges as fast-growing IT and semiconductor hub with strong electronics manufacturing push: Union Minister Ashwini Vaishnaw

The foundation stone of the Heterogeneous Integration Packaging Solutions project, promoted by 3D Glass Solutions, was laid in the presence of Chief Minister Shri Mohan Charan Majhi and Union Minister ...
Swarajya

India’s First Advanced 3D Chip Packaging Unit Breaks Ground In Odisha

India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip ...